AMNx Lab Blog

6 Quick Ways to Judge PCB Design Quality

Whether you're reviewing a contractor's work, evaluating a product teardown, or learning PCB design yourself, these six checkpoints will help you identify serious design flaws quickly.

Ahmed Amin
Ahmed Amin
December 2024 · 8 min read

1. Incorrect PCB Traces (Routing Issues)

Trace routing is one of the most visible indicators of design quality. Well-routed traces show attention to detail and understanding of signal integrity principles.

Key Rules
  • Avoid 90° sharp angles — Use 45° or curved bends. Sharp corners cause acid traps during manufacturing and impedance discontinuities.
  • High-current traces — Must be sufficiently wide to handle current without overheating.
  • Critical analog traces — Do NOT run parallel to digital or fast-switching traces to prevent noise coupling.

Note: If you see sharp 90° angles, it often means the designer didn't configure their CAD tools correctly.

2. Incorrectly Placed Decoupling Capacitors

Critical Design Flaw

Missing or poorly placed capacitors is a major red flag. This is the #1 indicator of amateur or bad design. Decoupling capacitors filter high-frequency noise from power supplies and must be strategically placed.

Every IC power pin needs proper decoupling. The effectiveness of a decoupling capacitor decreases exponentially with distance due to parasitic inductance in the traces.

Requirements Checklist

  • Every IC power pin needs at least one decoupling capacitor (typically 0.1 µF ceramic + 10 µF bulk electrolytic)
  • Capacitors MUST be placed within 5mm of the power pin (closer is better)
  • Via-in-pad or adjacent vias to ground plane are essential for low inductance
  • Multiple capacitor values provide filtering across different frequency ranges
Warning

If an outsourced designer does this wrong — consider it a serious red flag for the entire design.

PCB Trace Angle Comparison
Figure 1: 90° bends (Left) vs 45° bends (Right)

3. No Length Matching on High-Speed Signals

Signal propagation delay is approximately 6 inches per nanosecond in FR-4. For multi-gigabit interfaces, even millimeter-level mismatches cause timing skew that leads to data corruption.

This is critically important for:

  • DDR memory interfaces (DDR3/DDR4/DDR5)
  • Differential pairs (USB 3.0, PCIe, HDMI, DisplayPort)
  • Clock distribution networks
  • Parallel data buses above 50 MHz
Visual Inspection Guide
  • Look for serpentine traces (controlled meandering) to add precise delay
  • All signals in the same timing group must have matched lengths (within ±5 mils typically)
  • Equal number of vias per signal (each via adds ~50-100 ps delay)
  • Differential pair traces should be tightly coupled and length-matched within the pair

4. Improper RF Feed Lines

For any wireless or RF design, the antenna feed line is mission-critical. Impedance mismatches cause standing waves, signal reflections, and power loss—directly reducing transmission range and reception sensitivity.

At RF frequencies (above 100 MHz), traces behave as transmission lines and must maintain consistent characteristic impedance to prevent reflections.

Serpentine Trace Example
Figure 2: Serpentine traces used for length matching

5. Non-Optimized Component Placement

Component placement affects thermal management, signal integrity, and manufacturing yield.

Inductors

Separate them to avoid magnetic coupling. If they must be close, orient them perpendicular (90°) to each other.

Heat Management

Keep hot components (regulators, power resistors) away from temperature-sensitive parts like crystals, TCXOs, or sensors.

Switching Regulators

Group switching components tightly together. Keep them isolated from sensitive analog circuits to reduce noise coupling.

6. Poor Grounding

A solid ground plane is preferred for most designs. For 2-layer boards, use a star ground topology. Never daisy-chain grounds.

Common Fatal Mistake

Poor grounding causes voltage drops and signal noise. Ground traces have resistance — current causes voltage drops — distant ICs see a shifted/bouncing ground reference.

Best Practices

  • 4-layer boards: Use solid ground and power planes
  • Mixed analog/digital: Split ground planes, connect at one point (power supply)
  • 2-layer boards: Each IC/subcircuit gets its own ground return trace → star topology back to power supply GND

Summary Checklist

Check Item Target Notes
Trace Angles No 90° bends Use 45° or curves
Decoupling Caps Close to Pins Biggest giveaway of bad design
High-Speed Traces Length Matched Check for serpentines
RF Lines 50 Ω Impedance Specific width required
Inductors Spaced & Perpendicular Avoid magnetic coupling
Grounding Solid / Star Never daisy-chain
Keep This Handy

Use this checklist to quickly spot major design errors on any PCB — even if you're not an expert, you can identify serious problems in minutes on Gerbers or manufactured boards!